ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,449, issued on April 14, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Electromagnetic absorbing composites" was invent... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,449, issued on April 14, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Electromagnetic absorbing composites" was invent... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,450, issued on April 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Case" was invented by Kiyoyuki Nakagawa (Nagaokaky... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,450, issued on April 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Case" was invented by Kiyoyuki Nakagawa (Nagaokaky... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,451, issued on April 14, was assigned to FUJI Corp. (Chiryu, Japan). "Mounting system and mounting method" was invented by Takeshi Sakuray... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,451, issued on April 14, was assigned to FUJI Corp. (Chiryu, Japan). "Mounting system and mounting method" was invented by Takeshi Sakuray... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,452, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Compact electrical connection tha... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,452, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Compact electrical connection tha... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,453, issued on April 14, was assigned to ICLEAGUE TECHNOLOGY Co. LTD. (Jiaxing, China). "Semiconductor structure and method for forming se... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,453, issued on April 14, was assigned to ICLEAGUE TECHNOLOGY Co. LTD. (Jiaxing, China). "Semiconductor structure and method for forming se... Read More